3M™ Thermally Conductive Interface Pad 5506

3M™ Thermally Conductive Interface Pads consist of a highly conformable, slightly tacky silicone-elastomer sheet filled with thermally conductive ceramic particles and supported by protective release liners on both sides.

Characteristics:

• Available in thicknesses between 0.5 and 2.0 mm, in increments of 0.5 mm.
• High thermal conductivity
• Good gap-filling capability
• Low contact stresses and long-term reliability
• Exhibit good flexibility, high sheer strength and will not crumble or tear during normal handling operations, even when large part sizes are involved

Preferential heat-transfer path between heat-generating devices such as:

• Memory modules
• Graphic chips
• Cooling devices fans
• Heat pipes and heat sinks

The specialized silicone chemistry renders them extremely soft and compliant, allowing them to conform intimately to non-flat substrates, even at moderate pressure

As a result, contact pressures – which can damage delicate IC packages and/or the enclosed circuitry are minimized.

To view 3M™ data sheet click here

We can laminate this product to a variety of materials. We provide sheets, rolls, custom cut pieces or shapes to your exact specification.

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