Shielding, Absorbing, Grounding & Bonding Technology for Today's Electronics

From material selection to die cut design; we will help solve your electronic assembly or converting challenge. We are dedicated to being in the forefront of the latest technologies offering customers ways to speed assembly, add value, functionality and reliability of products.

Typical Products We Manufacture:

• EMI/RFI shields
• Resistors
• Conductive adhesive components
• PCB component attachment We will take your component(s), and create precision prototype samples in 48 hours or less.

Electronic Material Examples:

• High Temp Films -Kapton, Ultem, PTFE Teflon, etc
• EMI/RFI materials and finished shields
• Electrically conductive tape- xyz tape, xy tape, z-axis tape
• Thermally conductive tape- copper foil, aluminum
• Heat Shield Material- Nomex, fishpaper, foil tapes
• Misc- thermal bonding films, electroplating tapes, powder coating tape and more

All products can be converted to your exact size, laminated to other materials and produced with a split back liner or extended tab for easy removal. Components can be supplied kiss cut in rolls, sheets, pads, or loose pieces.

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Click here for links to 3M Electronics Assembly Solutions & 3M EMI Materials Guide.

Contact us today to learn more.